Silicon carbide structure, device, and method

ABSTRACT

A structure and method of fabricating suspended beam silicon carbide MEMS structure with low capacitance and good thermal expansion match. A suspended material structure is attached to an anchor material structure that is direct wafer bonded to a substrate. The anchor material structure and the suspended material structure are formed from either a hexagonal single-crystal SiC material, and the anchor material structure is bonded to the substrate while the suspended material structure does not have to be attached to the substrate. The substrate may be a semi-insulating or insulating SiC substrate. The substrate may have an etched recess region on the substrate first surface to facilitate the formation of the movable suspended material structures. The substrate may have patterned electrical electrodes on the substrate first surface, within recesses etched into the substrate.

PRIORITY CLAIM

The present application is a non-provisional application claiming the benefit of U.S. Provisional Application No. 62/464,814 filed on Feb. 28, 2017 by Francis J. Kub et al., entitled “SILICON CARBICE STRUCTURE, DEVICE, AND METHOD,” the entire contents of which is incorporated herein by reference.

BACKGROUND OF THE INVENTION Field of the Invention

The present invention relates to a structure and method of fabricating thick beam silicon carbide MEMS structure with low capacitance and good thermal expansion match.

Description of the Prior Art

3C-SiC is often used for microelectromechanical (MEMS) device structures. 3C-SiC material layers grown on silicon substrate typically have high residual stress, high dislocation density, and high surface roughness. The 3C-SiC material layers grown on a silicon substrate can be grown on silicon substrates with an (100) orientation surface or an (111) orientation surface. There is significant thermal expansion mismatch between the 3C-SiC epitaxial layer and a silicon substrate.

SiC beams have been implemented using hydrogen ion implant and splitting, but the hydrogen ion implantation limits the SiC beam thickness to approximately 1 SiC beams have also been implemented by photoelectrochemical selective etching, but the SiC beam thickness has been approximately 1 μm thick. Previous implementations have not discussed the use of a semi-insulating SiC substrate, which enables low parasitic capacitance for electrostatic sense electrodes. The approach of the present invention is to use direct wafer bonding of a top hexagonal single-crystal SiC second substrate used to form a suspended beam and anchor structure to a bottom semi-insulating single-crystal SiC first substrate.

BRIEF SUMMARY OF THE INVENTION

The present invention provides a structure and method of making a suspended beam silicon carbide MEMS structure (e.g., gyroscope, accelerometer, oscillator, inertial sensor) with low capacitance and good thermal expansion match of the suspended beam SiC material and anchor material to the first substrate SiC material. SiC provides higher modulus, higher density, and higher thermal conductivity than silicon, which are desirable properties for SiC MEMS systems. Hexagonal SiC provides superior isoelasticity (rotation symmetry) versus silicon reducing errors in gyroscope functioning. SiC provides higher stiffness and fracture toughness than silicon, improving shock resistance for high-G applications (e.g., missiles, rail gun projectile). SiC provides improved radiation hardness compared to silicon. SiC single-crystal hexagonal material bonded to SiC single-crystal hexagonal first substrate provides good thermal expansion match.

SiC material properties provide significant advantages for MEMS devices. A thick top hexagonal SiC N+ suspended beam enables lower noise. The use of single-crystal hexagonal SiC for both the top N+ suspended beams, the anchor material structure, and the optional electrostatic sense electrode and the bottom handle first substrate enables good thermal expansion match and low stresses. The use of semi-insulating SiC bottom first substrate enables low parasitic capacitance for electrostatic sense electrode and thus improved noise properties. Several other features (e.g., top side ohmic contact, bottom side ohmic contact, undercut, recesses) are described to implement improved SiC MEMS structures. SiC material has higher modulus, higher density, higher thermal conductivity, improved rotational symmetry, higher fracture strength, higher shock resistance, high radiation resistance than silicon.

These and other features and advantages of the invention, as well as the invention itself, will become better understood by reference to the following detailed description, appended claims, and accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic of a hexagonal 4H-SiC suspended material structure and anchor material structure with anchor material structure interface material layer(s) direct wafer bonded electrode with 4H-SiC suspended material structure to form one or more than one attached regions (clamped regions) to the anchor material structure to form beams, membranes, cantilevers, or bridges for MEMS applications.

FIG. 2 is a schematic of hexagonal 4H-SiC on laterally undercut interface material layer(s) on a hexagonal 6H-SiC substrate with trenches etched in 4H-SiC suspended material structure to form one or more than one attached regions (clamped regions) to the anchor material structure to form beams, membranes, cantilevers, or bridges for MEMS applications.

FIG. 3 is a schematic of a method to wafer bond hexagonal 4H-SiC material to a substrate with recess etched region and RIE protect material layer.

FIG. 4 is a schematic of a hexagonal single-crystal SiC on a hexagonal single-crystal semi-insulating SiC substrate (with recess etched region(s)) with high thermal conductivity direct wafer bond interface with trenches etched in hexagonal single-crystal SiC suspended material structure to form one or more than one clamped attachment to the anchor material region to form beams, membranes, cantilevers, or bridges for MEMS applications.

FIG. 5 is a schematic of a hexagonal single-crystal SiC on a hexagonal single-crystal semi-insulating SiC substrate (with recess etched regions(s)) with high thermal conductivity direct wafer bond interface with trenches etched in hexagonal single-crystal SiC suspended material structure to form one or more than one clamped attachment to the anchor material region to form beams, membranes, cantilevers, or bridges for MEMS applications.

FIG. 6 is a schematic of a combination of N-type epitaxial hexagonal SiC and N+ bulk hexagonal single-crystal SiC on optional interface material layer(s) on a hexagonal single-crystal substrate with trenches etched in hexagonal single-crystal SiC suspended material structure with one or more attachments to the anchor material region to form beams, membranes, cantilevers, or bridges for MEM applications.

FIG. 7 is a schematic of a combination of N-type epitaxial hexagonal SiC and N+ bulk hexagonal single-crystal SiC on optional interface material layer(s) on a hexagonal single-crystal substrate with trenches etched in hexagonal single-crystal SiC suspended material structure with one or more attachments to the anchor material region to form beams, membranes, cantilevers, or bridges for MEM applications.

FIG. 8 is a schematic of a combination of N-type epitaxial hexagonal SiC and N+ bulk hexagonal single-crystal SiC on optional interface material layer(s) on a hexagonal single-crystal substrate with trenches etched in hexagonal single-crystal SiC suspended material structure with one or more attachments to the anchor material region to form beams, membranes, cantilevers, or bridges for MEM applications.

FIG. 9 is a schematic of hexagonal single-crystal SiC on optional interface material layer(s) on a hexagonal single-crystal substrate with trenches etched in hexagonal single-crystal SiC suspended material structure and an RIE etch stop protect layer and electrical electrode that makes electrical contact to the anchor material region.

FIG. 10 is a schematic of hexagonal single-crystal SiC anodically bonded to a glass substrate and simultaneously metal-to-metal bond in a laterally separated region with an ME etch stop protect layer and electrical electrode that makes electrical contact to the anchor material region.

FIG. 11 is a schematic of hexagonal single-crystal SiC with anchor material regions electrically attached to a silicon substrate or a SiC substrate with epitaxial layer having microelectronic devices such as MOSFET for the control of and processing data from a microelectromechanical systems MEMS.

FIG. 12 is a schematic of hexagonal single-crystal SiC on optional interface material layer(s) on a hexagonal single-crystal substrate with trenches etched in hexagonal single-crystal SiC suspended material structure with the use of electrically conductive doped polycrystalline silicon surface to facilitate anodic bonding to a glass substrate.

FIG. 13 is a schematic of an example method to wafer bond hexagonal single-crystal material to a substrate with optional recess etched region and optional material layer.

FIG. 14 is a schematic of an example method to wafer bond hexagonal single-crystal material to a substrate with optional recess etched region and optional material layer.

DETAILED DESCRIPTION OF THE INVENTION

The present invention provides one or more than one suspended material structures comprising a hexagonal SiC material having a first surface and a second surface with each suspended material structure attached (fixed) to one or more than one anchor material structures. The anchor material structure comprises a hexagonal SiC material. In one embodiment, the anchor material structure is bonded (attached) to the substrate and the suspended material structure is not attached to the substrate. In one embodiment, the suspended material structure is electrically conductive and is doped either N-type or P-type. The substrate may have an etched recess region on the substrate first surface to facilitate the formation of the movable suspended material structures. The first substrate may have patterned electrically conductive electrodes on the first substrate first surface, within recesses etched into the first substrate. The patterned electrical electrodes on the first substrate surface beneficially prevent charge buildup on the surface, which can cause electrical non-uniformities. The electrical electrode ohmic contact can be formed on the first surface (topside) of the SiC material structure anchor material structure.

Example—Hexagonal SiC (4H-SiC or 6H-SiC)

This example includes process steps for the hexagonal SiC (4H-SiC or 6H-SiC) material structure bonded to a substrate and form suspended material structures that can be used for microelectromechanical beam, membranes, cantilevers, bridges, etc. In one embodiment, there is one or more than one suspended material structure that comprises hexagonal 4H-SiC material or hexagonal 6H-SiC material having a first surface and a second surface with each suspended material structure attached (fixed) to one or more than one anchor material structures that are direct wafer bonded (at the interface between two interface material layers) to a substrate. The anchor material structure comprises 4H-SiC or 6H-SiC material. In one embodiment, the anchor material structure and the suspended material structure are formed from a hexagonal SiC 4H-SiC material and the anchor material structure is bonded (attached) to the first substrate and the suspended material structure is not attached to the first substrate. The first substrate may be a semi-insulating or insulating SiC substrate. The first substrate may have an etched recess region on the first substrate first surface to facilitate the formation of the movable suspended material structures. The first substrate may have patterned electrically conductive electrodes on the substrate second first surface, within recesses etched into the first substrate. The electrical electrode ohmic contact can be formed on the first surface (topside) of the hexagonal 4H-SiC material structure anchor material structure.

FIG. 1 shows a 4H-SiC suspended material structure and anchor material structure with anchor material structure interface material layer(s) direct wafer bonded electrode with 4H-SiC suspended material structure to form one or more than one attached regions (clamped regions) to the anchor material structure to form beams, membranes, cantilevers, or bridges for MEMS applications. 6H-SiC first substrate with a recess etch region in the first substrate and an RIE etch protect material layer in the recess region that can optionally be an electrical electrode. The structure comprises a direct wafer bond interface 100, an anchor material structure region 102, trench etched regions 104, movable suspended 4H-SiC material structures 106 (beams, membranes, cantilever, or bridges) with one or more than one attachments to anchor structure material for MEMS applications, an optional electrostatic sense electrode 107, an electrical electrode contact 108 to second SiC substrate or thinned SiC second substrate, an optional doped region 110 in SiC to reduce ohmic contact resistance, an interface material layer 1 (optional CMP polished) 114, an interface material layer 2 (optional CMP polished) 112, a semi-insulating or insulating 4H-SiC or 6H-SiC first substrate 116, an RIE etch protect layer (optionally electrical conductive electrode) 118, and recess regions 120.

Hexagonal SiC Material

The suspended material structure, the anchor material structure, and the optional electrostatic sense electrode may be hexagonal 4H-SiC material or hexagonal 6H-SiC material.

The thickness of the hexagonal SiC may be in the range of about 50 nm to about 500 microns. For many applications, it is advantageous that the suspended material structure that forms a suspended beam be thicker to have a higher mass in the suspended beam that enables a lower Brownian mechanical noise. The Brownian noise corresponds to an equivalent acceleration noise of

A _(n) ²=(4 k_(B) Tb)/m²

Where k_(B) is the Boltman's constant, T is the temperature in Kelvin, b is the damping coefficient, and M is the proof mass. A suspended material structure with a thickness in the range of about 1 micron to about 500 microns can be formed by wafer bonding a bulk hexagonal 4H-SiC or 6H-SiC second substrate and then thinning the hexagonal second substrate to selected thickness. This is to be contrasted with the thickness capability for cubic 3C-SiC. Cubic 3C-SiC is typically grown on a silicon substrate and is limited to a thickness less than 20 microns, and has high levels of residual stress and high levels of defects. In some embodiments, an hexagonal SiC suspended material structure can be about 1 microns thick. In some embodiments, an hexagonal SiC suspended material structure can be about 2 microns thick. In some embodiments, a hexagonal SiC suspended material structure can be about 4 microns thick. In some embodiments, a hexagonal SiC suspended material structure can be about 10 microns thick. In some embodiments, a hexagonal SiC suspended material structure can be about 20 microns thick. In some embodiments, a hexagonal SiC suspended material structure can be about 40 microns thick. In some embodiments, a hexagonal SiC suspended material structure can be about 100 microns thick. In some embodiments, a hexagonal SiC suspended material structure can be about 200 microns thick. In some embodiments, a hexagonal 4H-SiC suspended material structure can be about 500 microns thick.

It is desirable that the suspended material structure beam be mechanically anchored in a manner that reduces or eliminates transfer of strain from the first substrate into the suspended material structure beam so that the microelectromechanical device or transducer is strain-tolerant. The technique includes using an electrically insulator for mechanical coupling and electrical isolation The transfer of strain from the first substrate is also minimized by using a semi-insulting or insulating single-crystal hexagonal SiC first substrate so that the linear coefficient of thermal expansion is about equal for both the first substrate and the 4H-SiC suspended and anchor material structure.

In some embodiments, the aggregate linear thermal expansion coefficient of the first substrate may have a value that is within about 1 percent of the thermal expansion coefficient on the SiC material for the SiC suspended beam, within about 2 percent of the thermal expansion coefficient on the SiC material for the SiC suspended beam, within about 5 percent of the thermal expansion coefficient on the SiC material for the SiC suspended beam, within about 10 percent of the thermal expansion coefficient on the SiC material for the SiC suspended beam, within about 20 percent of the thermal expansion coefficient on the SiC material for the SiC suspended beam

A significant advantage of the use of bulk and epitaxial hexagonal single-crystal SiC material for the suspended material structure and the anchor structure is that bulk hexagonal single-crystal SiC used for the suspended beam can have residual stress less than about 100 MPa in some embodiments, residual stress less than about 50 MPa in some embodiments, residual stress less than about 20 MPa in some embodiments, and can have residual stress less than about 10 MPa in some embodiments. This is contrasted with 3C-SiC, which typically has a residual stress greater than 400 MPa.

An advantage of 4H-SiC material for the suspended material structure and the anchor material structures is that 4H-SiC material has a dislocation density less than about 1×10⁵ cm⁻² (Salwe et al., “Bulk growth of SiC—review on advances of SiC vapor growth for improved doping and systematic study on dislocation evolution,” Silicon Carbide, Vol. 1: Growth, Defects, and Novel Applications, edited by Peter Friedrichs, Tsunenobu Kimoto, Lotar Ley, and Gerhard Pensl, 2010 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim ISBN: 978-3-527-40953-2). The values for the (0006) X-ray rocking curve were less than about 0.135 degrees FWHM and about 0.047 degrees FWHM for high temperature growth. Other reports for dislocation density of less than 1×10⁴ cm⁻² (Omote, “Crystal defect in SiC wafers and a new X-ray topography system,” The Rigoku Journal, 29(1) pp. 1-8 (2013) and Paskova, Nitrides with Nonpolar Surfaces: Growth Properties and Devices, page 76). While not available commercially, the best reported dislocation density for bulk 4H-SiC is about 1×10² cm⁻² (Nakamur et al., “Ultrahigh-quality Silicon Carbides,” Nature 430, 1009 (2004)). A low dislocation density is desirable to reduce the mechanical loss in suspended material structure beam and achieve high “Q” values. This contrasted with cubic 3C-SiC which has high levels of dislocation density because of growth on lattice mismatched silicon substrates.

A lower 4H-SiC dislocation density can be obtained by growth of 4H-SiC epitaxial layers on 4H-SiC substrate. The 4H-SiC epitaxial layers on 4H-SiC substrate can have a dislocation density less than about 1×10⁴ cm⁻².

The epitaxial growth of 4H-SiC material layers on 4H-SiC bulk substrates requires the use of off-axis orientation from the (0001) c-axis or from the (000-1)(overbar) c-axis of more than about 2 degrees in some embodiments, more than 4 degrees in some embodiments, and more than about 8 degrees in some embodiments.

The hexagonal SiC suspended material structure, the anchor material structure, and the optional electrostatic sense electrode may be doped N-type or P-type. The resistivity of the hexagonal SiC suspended material structure, the anchor material structure and the optional electrostatic sense electrode may in some embodiments be in about 0.015 ohm-cm, in some embodiments be in about 0.025 ohm-cm, in some embodiments be in about 0.05 ohm-cm, in some embodiments be in about 0.1 ohm-cm, in some embodiments be in about 0.2 ohm-cm, in some embodiments be in about 0.5 ohm-cm, in some embodiments be in about 1.0 ohm-cm, in some embodiments be in about 5.0 ohm-cm, and in some embodiments be in about 20.0 ohm-cm.

The suspended material structure, the anchor material structure material, and the optional electrostatic sense electrode may be formed from a bulk single-crystal hexagonal 4H-SiC or 6H-SiC substrate. The suspended material structure, the anchor material structure material, and the optional electrostatic may be a thinned bulk single-crystal hexagonal 4H-SiC or 6H-SiC substrate. The single-crystal hexagonal SiC material has a high modulus.

The suspended material structure beam can be widely applied to a variety of sensors. For example, a variable capacitor may be simply formed by adjusting the distance between two adjacent suspended beams. In such way, the MEMS sensor (e.g. an accelerometer) will be further fabricated. The suspended material structure may comprise a suspended 4H-SiC material layer structure that is single-clamped or double-clamped to SiC material layer structure(s) that is (are) connected to an anchor.

Interface Material Layer

The interface material layer can have the properties of low surface roughness suitable for direct wafer bonding, lateral undercut to facilitate the fabrication of a movable suspended material structure. The interface material layer(s) can include, but not be limited to, a silicon oxide material layer. The interface material layer can absorb hydrogen that is advantageous for direct wafer bonding. The interface material layer can have a surface roughness of less than about 0.5 nm RMS that is advantageous for direct wafer bonding (fusion wafer bonding). The surface of the interface material layers can be chemical mechanical polished to reduce the surface roughness to less than about 0.5 nm RMS. The interface material layers can optionally be laterally undercut to enable a movable suspended material structure using processes such as HF vapor etching, anhydrous HF vapor etching, and wet chemical dilute HF etching for the case of a silicon oxide interface material layer.

FIG. 2 shows 4H-SiC on laterally undercut interface material layer(s) on a 6H-SiC substrate with trenches etched in 4H-SiC suspended material structure to form one or more than one attached regions (clamped regions) to the anchor material structure to form beams, membranes, cantilevers, or bridges for MEMS applications. 6H-SiC first substrate with a recess etch region in the first substrate and an RIE etch protect material layer in the recess region that can optionally be an electrical electrode. The structure comprises a direct wafer bond interface 200, an anchor material structure region 202, trench etched regions 204, movable suspended 4H-SiC material structures 206 (beams, membranes, cantilever, or bridges) with one or more than one attachments to anchor structure material for MEMS applications, an optional electrostatic sense electrode 207, an electrical electrode contact to SiC 208, an interface material layer 1 (optional CMP polished) 212, an interface material layer 2 (optional CMP polished) 210, a 6H-SiC first substrate (optionally semi-insulating) 214, an RIE etch protect layer (optionally electrical electrode) 216, and a lateral undercut of one or more than one interface material layers to form undercut regions 218.

First Substrate

The first substrate may be a semi-insulating or insulating single-crystal hexagonal 4H-SiC or 6H-SiC substrate. The substrate may include, but not be limited to, a high mechanical strength substrate, a high thermal conductivity substrate, a matched thermal conductivity substrate, a low total thickness variation (TTV) substrate, a substrate with low total thickness variation (TTV) and also an low thickness uncertainty, a substrates with patterned electrical electrodes on the surface of the substrate, a substrate with patterned electrical electrodes formed in the recesses of the substrate, a low cost substrate, an optically transparent substrate, or any combination thereof. The first substrate properties may include, but not be limited to, a semi-insulating SiC substrate or an insulating SiC substrate. The first substrate may be patterned and etched to form recessed regions in the first substrate. Electrical electrodes may be formed in the recess.

Semi-insulating or insulating hexagonal 4H-SiC or 6H-SiC have the properties that the substrates have high mechanical strength substrate, high thermal conductivity substrate (>300 W/mK), can be a semi insulating substrate (>1×10⁵ ohm-cm), and can be an insulating substrate.

The hexagonal 4H-SiC material that is used to form the suspended material structure can be bonded on a first substrate with approximately matched linear coefficient of thermal expansion. An advantage of have a substrate with a linear coefficient of expansion that about matches the linear thermal expansion coefficient of the 4H-SiC material layer is that the matched thermal coefficient of expansion facilitates the wafer bonding of the two material layer. Material layers with different thermal expansion coefficient can debond, crack and have significant wafer bow during from higher temperature processes such as annealing to increase the bond strength or growth of a thermal oxide layer. The semi-insulating or insulating 4H-SiC or 6H-SiC first substrate approximately matches the linear thermal coefficient of expansion of the single crystal hexagonal SiC layer used to form the suspended material structure. Thus, very thick 4H-SiC material layers can be bonded without extensive substrate or wafer bow. For example, the hexagonal 4H-SiC or 6H-SiC material layer may be about 20 microns thick in some embodiments, 40 microns thick in some embodiments, about 100 microns thick in some embodiments, about 200 microns in some embodiments, and about 500 microns thick in some embodiments.

Suspended Microelectromechanical Material Structures

A MEMS device may be configured as a resonator that is used in timing devices. The resonator may have a variety of physical shapes, e.g., beams and plates. The MEMS device may have a portion suspended from the first substrate (e.g., a suspended mass, body, or resonator) attached to the first substrate by an anchor. The suspended material structure may be a feature such as, but not limited to, a beam, a plate, a bridge, a cantilever arm, or a tuning fork. In a specific embodiment, a MEMS device includes a resonating feature (e.g., suspended mass) flanked by one or more drive electrodes and one or more sense electrodes.

In some embodiments, the movable suspended material structure(s) comprise a hexagonal 4H-SiC material layer on a silicon oxide layer on a first substrate that is laterally undercut to form a movable suspended material structure beam.

In some embodiments, the movable suspended material structure(s) comprise a 4H-SiC material layer on a first substrate with etched recess regions to aid in enabling movable suspended material structures. The first substrate may have patterned electrical electrodes within the etched recesses.

A recess region can be formed in the in the first substrate on the first substrate first surface prior to the wafer bonding on the 4H-SiC material layer. The recess region can enable movable 4H-SiC material structures that are formed by plasma etching of trenches vertically entirely through 4H SiC material layer. An etch protect material layer may be formed within the recess region that can also function as an electrical electrode.

Thinning of 4H-SiC Material Layer

After wafer bonding of the 4H-SiC material to the first substrate at the interface material surfaces, the 4H-SiC material that is used to form the suspended material structure can be thinned to a selected thickness a combination of grinding, CMP polishing, and/or RIE etching. The selected thickness of the 4H-SiC material used to form the suspended material structure can be for example 1 micron thick, 2 micron thick, 4 micron thick, 10 micron thick, 20 micron thick, 40 micron thick, 100 micron thick, 200 um micron thick, or 500 micron thick. One approach to reduce the residual stress and subsurface damage at the first surface of the suspended material structure of the thinning operation is to use a stress release chemical mechanical polish (CMP) and/or a plasma etch process.

Deep Trench SiC Etching

In some MEMS devices, the actuation or sensing can be by electrostatic coupling. The deep trench etching of 4H-SiC can be performed by approaches that include but are not limited to RIE etching or ICP RIE etching. The ICP RIE etching often has etch rates of 500 nm per minute to 1000 nm per minute. The sidewall angle of the deep trench can be in the range of about 3 degrees to 15 degrees off of the vertical axis. The aspect ratio of the deep trench can be in the range of greater than 5 to 1 to greater than 100 to 1. The electrostatic coupling between the suspended material structure and the anchor material structure is dependent on the width of the trench etched region. The width of the trench can be as small as about 0.5 microns or as large as about 5 to 8 microns. The width of the deep trench can be about 1 micron for a suspended material structure than is less than about 10 microns thick. The width of the deep trench can be about 2 micron for a suspended material structure than is less than about 20 microns thick. The width of the deep trench can be about 3 micron for a suspended material structure than is less than about 40 microns thick. The width of the deep trench can be about 4 micron for a suspended material structure than is less than about 60 microns thick. The deep trench etch entirely through the thickness of the N-type hexagonal single-crystal layer can be performed by ICP-RIE SiC etching using gases such SF6 plus argon, oxygen, or other gases to form movable suspended material structures above the recesses.

Electrostatic coupling to a 4H-SiC beam typically requires that the beam have an electrical conductivity and thus it is typically preferred that the 4H-SiC material be doped N-type with a doping concentration in the range of 5×10¹⁸ cm⁻³ to 1×10¹⁹ cm⁻³. Commercial 4H-SiC or 6H-SiC substrates can be N-type. 4H-SiC epitaxial layers can be grown to be N-type or P-type.

Methods Example Method 1: Metal Electrode Contact to the First Surface of the Anchor Material Structure

-   -   1. 6H-SiC semi-insulating or insulating first substrate.     -   2. Thin and polish the 6H-SiC semi-insulating first substrate to         a low total thickness variation (TTV) and to a selected         thickness.     -   3. Photolithography step 1: Photodefine region for etching         alignment marks in the semi insulating first substrate.     -   4. RIE etch alignment marks about 0.1-0.3 microns deep into the         6H semi-insulating SiC first substrate and strip etch-mask.     -   5. Photolithography step 2: Photodefine region for etching a         recess in the first surface of the semi-insulating first         substrate.     -   6. RIE etch a recess about three microns deep into the first         surface of the 6H semi-insulating first substrate and strip         etch-mask.     -   7. Grow about 40 nm thermal oxide interface material layer on         first surface and recess surface of the semi-insulating first         substrate.     -   8. Grow about 40 nm thick thermal oxide on N-type 4H-SiC second         substrate.     -   9. Photolithography step 3: Photodefine RIE etch protect         material layer. The RIE etch protect layer is a material layer         that has a slow etch rate in the SiC RIE etch gases. The RIE         etch protect layer may include but not be limited to nickel         metal layer or aluminum metal layer. The RIE etch protect layer         can also be an electrical electrode.     -   10. Direct wafer bond the first surface of the 4H or 6H         semi-insulating SiC surface to the N-type doped 4H-SiC material.     -   11. Anneal at 400° C. to 1100° C. to increase the bond strength         of the direct wafer bonded region.     -   12. Thin the N-type doped 4H-SiC material to 40 micron final         thickness and perform CMP polish to minimize stress and remove         subsurface damage.     -   13. Photolithography step 4: Photodefine region for etching         top-side alignment marks in the N type doped 4H-SiC material.     -   14. RIE etch alignment marks about 0.1-0.3 microns deep into the         N-type doped 4H-SiC material and strip etch-mask.     -   15. Photolithography step 5: Photodefine a metal layer that         makes ohmic contact to N-type 4H SiC first surface. A thin         titanium layer (about 10 nm) and a nickel layer about 100 nm         thick can be used to make an ohmic contact to the first surface         of the N-type 4H-SiC material layer after heat-treatment.     -   16. Photolithography step 6: Photodefine a gold layer 300 nm or         thicker that can facilitate the wire bonding to the metal on the         first surface of the N-type 4H-SiC material layer.     -   17. Photolithography step 7: Photodefine a protect layer         material layer that protects the metal for the ohmic contact to         the first surface of the N-type 4H-SiC material layer. The         protect layer material may be gold or another material resistant         to the chemicals used in subsequent steps.     -   18. Photolithography step 8: Photodefine a material layer that         performs as a RIE etch definition layer for the SiC trench etch         on the first surface of the N-type 4H-SiC. The RIE etch         definition layer that defines where SiC will be etched can be a         nickel layer or an aluminum layer, for example. The nickel layer         can be formed by electroplating nickel inside of a photodefined         resist mode or deposition of nickel and a resist or dielectric         masking layer followed by a subtractive etch using ion beam         milling or plasma etching. Nickel can also be etched by chemical         etching. The aluminum layer can be subtractive etched by RIE         plasma etch.     -   19. Perform the ICP-RIE SiC trench etch entirely through the         thickness of the N-type 4H-SiC layer using gases such SF6 plus         argon, oxygen, or other gases to form movable suspended material         structures above the recesses.     -   20. Etch the interface material layer 2 using an HF vapor etch,         an anhydrous HF vapor etch or a dilute HF vapor etch.     -   21. Remove the nickel masking layer and then perform critical         point drying to prevent striction.     -   22. Shadow mask deposit gold wire-bond pads for contact to         recess metal.     -   23. Separate, die-bond, and wire-bond to MEMS die.

FIG. 3 shows an example method to wafer bond 4H-SiC material to a substrate with recess etched region and RIE protect material layer.

Example—Advanced Silicon Carbide Structure, Devices and Method

This method includes process steps for the hexagonal single-crystal SiC anchor material structure bonded to a substrate and forming suspended material structures that can be used for microelectromechanical beam, membranes, cantilevers, bridges etc.

Example Device Embodiment 1

In one embodiment, one or more than one suspended material structures comprise a hexagonal single-crystal SiC material having a first surface and a second surface with each suspended material structure attached (fixed) to one or more than one anchor material structures that are bonded to a substrate with no interface material layer, one optional interface material layer or more than one optional interface material layers at the interface between the hexagonal single-crystal SiC material layer and the substrate. The anchor material structure comprises hexagonal single-crystal hexagonal SiC material. The anchor material structure and the suspended material structure are formed from a single-crystal hexagonal SiC material and the anchor material structure is bonded (attached) to the substrate and the suspended material structure is not attached to the substrate. The substrate may be a hexagonal single-crystal SiC substrate which may be conductive with N-type doping, conductive with P type doping, semi-insulating or insulating. Other types of substrates may include but not be limited to a silicon substrate, a glass substrate, or a ceramic substrate. The substrate may have an etched recess region on the substrate first surface to facilitate the formation of the movable suspended material structures. The substrate may have patterned electrical electrodes on the substrate first surface, within recesses etched into the substrate, and within recesses etched into the substrate and on the substrate first surface. The electrical electrode ohmic contact can be formed on the first surface (topside) of the hexagonal single-crystal material structure anchor material structure.

FIG. 4 shows hexagonal single-crystal SiC on a hexagonal single-crystal semi-insulating SiC substrate (with recess etched regions(s)) with high thermal conductivity direct wafer bond interface with trenches etched in hexagonal single-crystal SiC suspended material structure to form one or more than one clamped attachments to the anchor material region to form beams, membranes, cantilevers, or bridges for MEMS applications. The structure comprises a high thermal conductivity direct wafer bond interface 400, an anchor material structure region 402, trench etched regions 404, movable suspended hexagonal single-crystal SiC material structures 406 (beams, membranes, cantilever, or bridges) with one or more than one attachments to anchor structure material for MEMS applications, an electrical electrode contact to SiC 408, an optional doped region 410 in SiC to reduce ohmic contact resistance, a hexagonal single-crystal semi-insulating SiC substrate 416, an RIE etch protect layer (optionally electrical electrode) 418, and recess regions 420.

FIG. 5 shows hexagonal single-crystal SiC on a hexagonal single-crystal semi-insulating SiC substrate (with recess etched regions(s)) with high thermal conductivity direct wafer bond interface with trenches etched in hexagonal single-crystal SiC suspended material structure to form one or more than one clamped attachments to the anchor material region to form beams, membranes, cantilevers, or bridges for MEMS applications. The structure comprises a high thermal conductivity direct wafer bond interface 500, an anchor material structure region 502, trench etched regions 504, movable suspended hexagonal single-crystal SiC material structures 506 (beams, membranes, cantilever, or bridges) with one or more than one attachments to anchor structure material for MEMS applications, an electrical electrode contact to SiC 508, an optional doped region 510 in SiC to reduce ohmic contact resistance, a hexagonal single-crystal semi-insulating SiC substrate 516, and recess regions 520.

Hexagonal Single-Crystal SiC Material

The hexagonal single-crystal SiC material in the suspended material structure, the anchor material structure, and the sense electrode material structure may include, but not be limited to, single-crystal 6H-SiC material and single crystal 4H-SiC material.

The thickness of the hexagonal single-crystal SiC may be in the range of about 50 nm to 200 microns. For many applications, it is advantageous that the suspended material structure that forms a suspended beam be thicker to have a higher mass in the suspended beam that enables a lower Brownian mechanical noise. The Brownian noise corresponds to an equivalent acceleration noise of

A _(n) ²=(4 k_(B) Tb)/m²

Where k_(B) is the Boltman's constant, T is the temperature in Kelvin, b is the damping coefficient, and M is the proof mass. A suspended material structure with a thickness in the range of about 1 micron to 500 microns can be formed by wafer bonding a bulk hexagonal single-crystal SiC substrate and then thinning to selected thickness. This is to be contrasted with the thickness capability for cubic 3C-SiC. Cubic 3C-SiC is typically grown on a silicon substrate and is limited to a thickness less than 20 microns, and has high levels of residual stress and high levels of defects. A hexagonal single-crystal SiC suspended material structure in the range of about 50 nm to 2 micron thick can be formed using a wafer bonding and hydrogen ion material splitting approach. In some embodiments, a hexagonal single-crystal SiC suspended material structure can be about 50 nm thick. In some embodiments, a hexagonal single-crystal SiC suspended material structure can be about 100 nm thick. In some embodiments, a hexagonal single-crystal SiC suspended material structure can be about 500 nm thick. In some embodiments, a hexagonal single-crystal SiC suspended material structure can be about 1 micron thick. In some embodiments, a hexagonal single-crystal SiC suspended material structure can be about 2 microns thick. In some embodiments, a hexagonal single-crystal SiC suspended material structure can be about 4 microns thick. In some embodiments, a hexagonal single-crystal SiC suspended material structure can be about 10 microns thick. In some embodiments, a hexagonal single-crystal SiC suspended material structure can be about 20 microns thick. In some embodiments, a hexagonal single-crystal SiC suspended material structure can be about 40 microns thick. In some embodiments, a hexagonal single-crystal SiC suspended material structure can be about 100 microns thick. In some embodiments, a hexagonal single-crystal SiC suspended material structure can be about 200 microns thick. In some embodiments, a hexagonal single-crystal SiC suspended material structure can be about 500 microns thick.

It is desirable that the suspended material structure have low residual stress or strain and relatively low induced stress or strain from changes in operation temperature. The hexagonal single-crystal SiC suspended material structure may be formed by thinning a bonded hexagonal single-crystal SiC substrate after wafer bonding. One approach to reduce the residual stress and subsurface damage at the first surface of the suspended material structure of the thinning operation is to use a stress release chemical mechanical polish (CMP) and/or a plasma etch process. In addition, the stress in the hexagonal single-crystal suspended material structure as the operation temperature changes can be minimized by using a SiC substrate so that the linear coefficient of thermal expansion is about equal for both the substrate and the hexagonal single crystal suspended material structure. A significant advantage of the use of bulk and epitaxial hexagonal single-crystal SiC material for the suspended material structure and the anchor structure is that bulk hexagonal single-crystal SiC can have residual stress less than about 100 MPa in some embodiments and can have residual stress less than about 20 MPa in some embodiments. This is contrasted with 3C-SiC which typically has a residual stress greater than 400 MPa.

It is desirable that the suspended material structure beam be mechanically anchored in a manner that reduces or eliminates transfer of strain from the substrate into the suspended material structure beam so that the microelectromechanical device or transducer is strain-tolerant. The technique includes using an electrically insulating for mechanical coupling and electrical isolation. The transfer of strain from the substrate is also minimized by using a SiC substrate so that the linear coefficient of thermal expansion is about equal for both the substrate and the hexagonal single-crystal suspended material structure stress as the operation temperature changes can be minimized.

An advantage of hexagonal single-crystal SiC material for the suspended material structure and the anchor material structure is that hexagonal single-crystal material SiC material has a dislocation density less than about 1×10⁵ cm⁻² (Salwe et. al., “Bulk growth of SiC—review on advances of SiC vapor growth for improved doping and systematic study on dislocation evolution,” Silicon Carbide, Vol. 1: Growth, Defects, and Novel Applications, Edited by Peter Friedrichs, Tsunenobu Kimoto, Lothar Ley, and Gerhard Pensl, 2010 WILEY-VCR Verlag GmbH & Co. KGaA, Weinheim ISBN: 978-3-527-40953-2). The values for the (0006) X-ray rocking curve were less than about 0.135 degrees FWHM and about 0.047 degrees FWHM for high temperature growth. Other reports for dislocation density of less than 1×10⁴ cm⁻² (Ornate, “Crystal defect in SiC wafers and a new X-ray topography system,” The Rigoku Journal, 29(1) pp. 1-8, 2013 and Paskova, “Nitrides with Nonpolar Surfaces: Growth Properties and Devices,” page 76). While not available commercially, the best reported dislocation density for bulk hexagonal SiC is about 1×10² cm⁻² (Nakamur, et. al., “Ultrahigh-quality Silicon Carbide Single-crystals,” Nature, 430 1009 (2004)). A low dislocation density is desirable to reduce the mechanical loss in suspended material structure beam and achieve high “Q” values. This contrasted with cubic single-crystal 3C-SiC which has high levels of dislocation density because of growth on lattice mismatched silicon substrates.

Hexagonal single-crystal SiC substrate can have a silicon face (0001) or a carbon face (000-1)(overbar).

A lower hexagonal single-crystal SiC dislocation density can be obtained by growth of hexagonal single-crystal epitaxial layers on hexagonal single-crystal SiC substrate. The hexagonal single-crystal epitaxial layers on hexagonal single-crystal SiC substrate can have a dislocation density less than about 1×10⁴ cm⁻².

The epitaxial growth of hexagonal single-crystal SiC material layers on hexagonal single-crystal SiC bulk substrates requires the use of off-axis orientation of from the (0001) c-axis or from the (000-1)(overbar) c-axis of more than about 2 degrees in some embodiments, more than 4 degrees in some embodiments, and more than about 8 degrees in some embodiments.

The epitaxial growth of 4H-SiC single-crystal SiC material layers on the silicon face of hexagonal single-crystal SiC bulk substrates requires the use of off-axis orientation from the (0001) c-axis of more than about 2 degrees in some embodiments, more than 4 degrees in some embodiments, and more than about 8 degrees in some embodiments. The 4H-SiC epitaxial layers grown on the silicon face can be doped N-type or P-type to a selected doping level. 4H-SiC single-crystal SiC material layers can also be grown on the carbon face of 4H-SiC single-crystal substrates. The epitaxial growth of 4H-SiC single-crystal SiC material layers on the carbon face hexagonal single-crystal SiC bulk substrates requires the use of off-axis orientation from the (0001) c-axis of more than about 2 degrees in some embodiments, more than 4 degrees in some embodiments, and more than about 8 degrees in some embodiments. The 4H-SiC epitaxial layers grown on the carbon face can be doped N-type or P-type to a selected doping level.

FIG. 6 shows a combination of N-type epitaxial hexagonal SiC and N+ bulk hexagonal single-crystal SiC on optional interface material layer(s) on a hexagonal single-crystal substrate with trenches etched in hexagonal single-crystal SiC suspended material structure with one or more attachments to the anchor material region to form beams, membranes, cantilevers, or bridges for MEM applications. The structure comprises a direct wafer bond interface 600, an anchor material structure region 602, trench etched regions 604, movable suspended hexagonal single-crystal SiC material structures 606 (beams, membranes, cantilevers, or bridges) with one or more than one attachments to anchor structure material for MEMS applications, an electrical electrode contact to SiC 608, an N+ bulk hexagonal single-crystal SiC material layer 609, an N-type epitaxial hexagonal single-crystal SiC material layer 610, an optional interface material layer 1 (optional CMP polished) 614, an optional interface material layer 2 (optional CMP polished) 612, a hexagonal single-crystal SiC substrate (optionally semi-insulating) 616, an ME etch protect layer (optionally electrical electrode) 618, and recess regions 620.

FIG. 7 shows a combination of N-type epitaxial hexagonal SiC and N+ bulk hexagonal single-crystal SiC on optional interface material layer(s) on a hexagonal single-crystal substrate with trenches etched in hexagonal single-crystal SiC suspended material structure with one or more attachments to the anchor material region to form beams, membranes, cantilevers, or bridges for MEM applications. The structure comprises a direct wafer bond interface 700, an anchor material structure region 702, trench etched regions 704, movable suspended hexagonal single-crystal SiC material structures 706 (beams, membranes, cantilevers, or bridges) with one or more than one attachments to anchor structure material for MEMS applications, an electrical electrode contact to SiC 708, an optional doped region 709 in SiC to reduce ohmic contact resistance, an N-type epitaxial hexagonal single-crystal SiC material layer 710, an optional interface material layer 1 (optional CMP polished) 714, an optional interface material layer 2 (optional CMP polished) 712, a hexagonal single-crystal SiC substrate (optionally semi-insulating) 716, an ME etch protect layer (optionally electrical electrode) 718, and recess regions 720.

FIG. 8 shows a combination of N-type epitaxial hexagonal SiC and N+ bulk hexagonal single-crystal SiC on optional interface material layer(s) on a hexagonal single-crystal substrate with trenches etched in hexagonal single-crystal SiC suspended material structure with one or more attachments to the anchor material region to form beams, membranes, cantilevers, or bridges for MEM applications. The structure comprises a direct wafer bond interface 800, an anchor material structure region 802, trench etched regions 804, movable suspended hexagonal single-crystal SiC material structures 806 (beams, membranes, cantilevers, or bridges) with one or more than one attachments to anchor structure material for MEMS applications, an electrical electrode contact to SiC 808, an N+ bulk hexagonal single-crystal SiC material layer 809, an N-type epitaxial hexagonal single-crystal SiC material layer 810, an optional interface material layer 1 (optional CMP polished) 814, an optional interface material layer 2 (optional CMP polished) 812, a hexagonal single-crystal SiC substrate (optionally semi-insulating) 816, an RIE etch protect layer (optionally electrical electrode) 818, and recess regions 820.

The hexagonal single-crystal SiC suspended material structure and the anchor material structure may be doped N-type or P-type. The doping concentration in the hexagonal single crystal suspended material structure and anchor structure may be selected for a low doping concentration for some applications or for high doping concentrations in other applications. For example, a capacitive accelerometer would prefer a high doping concentration in the hexagonal single-crystal suspended material structure. The high doping concentration can be in the range of about 1×10¹⁶ cm⁻³ to about 1×10²⁰ cm⁻³ doping concentration. A low doping concentration can be preferred for a suspended material structure. For example, a low doping in the suspended material structure for the case of thermally actuated MEMS oscillator in which case the suspended material structure can perform as a resistive thermal actuator. The low doping concentration can be in the range from about 5×10¹³ cm⁻³ to about 1×10¹⁸ cm⁻³ to enable a resistor that can be used for thermal actuation. There can be lateral patterned selected doping regions into the first and/or second surface of the hexagonal single-crystal SiC suspended material structure and anchor material structure formed by ion implantation and annealing of dopants or alternately by diffusion of dopants. There can be vertically stacked doping layer in the hexagonal single crystal SiC suspended material structure and anchor material structure formed by ion implantation and annealing of dopants, diffusion of dopants, or by epitaxial growth of vertically stacked doping layers. These doping regions and/or doping layers can be used to facilitate ohmic electrical contact formation to the suspended material structure and the anchor material structure. A high doping concentration is typically preferred for ohmic contact formation.

The fixed oxide charge on the surface of SiC is typically a positive fixed oxide charge. Thus, the surface of N-type SiC is typically accumulated while the surface of P-type SiC can be inverted of depleted. A high surface state density on the exposed surfaces of the SiC can degrade the “Q” of microelectromechanical devices and it can be desirable to reduce the surface state density. The surface state density on the surface of SiC can be reduced approaches such annealing oxide or growing oxides formed on the surface of SiC in nitrogen containing ambients such as nitrous oxide at high temperatures. The surface state density of SiC can also be lowered by growth of layers of lanthanum-doped oxide, barium doped oxides, or strontium doped oxides. Methods to grow passivation layers on the exposed surface SiC include but are not limited to dry thermal oxidation, wet thermal oxidation, combination of dry and wet thermal oxidation, atomic layer deposition, molecular vapor deposition, chemical vapor deposition, and glow discharge.

The suspended material structure and the anchor material structure material may include but not be limited to bulk hexagonal single-crystal SiC, a stacked layer of bulk hexagonal single crystal SiC and epitaxial hexagonal single-crystal SiC or epitaxial hexagonal single-crystal SiC.

The suspended material structure beam can be widely applied to a variety of sensors. For example, a variable capacitor may be simply formed by adjusting the distance between two adjacent suspended beams. In such way, the MEMS sensor (e.g. an accelerometer) will be further fabricated. The suspended material structure may be comprise a suspended hexagonal-Sic material layer structure that is single-clamped or double-clamped to SiC material layer structure(s) that is (are) connected to an anchor.

A technique decouples a microelectromechanical system (MEMS) device from sources of strain by forming a MEMS structure with suspended electrodes that are mechanically anchored in a manner that reduces or eliminates transfer of strain from the substrate into the structure, or transfers strain to electrodes and body so that a transducer is strain-tolerant. The technique includes using an electrically insulating material embedded in a conductive structural material for mechanical coupling and electrical isolation.

Hexagonal single-crystal material has a high modulus. SiC material offers the potential of being extremely radiation hard due to the large displacement energy for atom displacement of 21.8 eV. The number of atomic displacements created by an energetic ion, according to the Kinchin-Pease formula, is inversely proportional to the displacement energies.

Wafer Bonding

Bonding approaches for bonding the SiC material that will form the anchor material structures to the substrate include but are not limited to direct wafer bonding, fusion bonding, laminating, anodic bonding, polymer bonding, metal to metal bonding, metallic-alloy bonding, metallic liquid phase bonding, or glass-frit bonding. It is desirable that the bonding be performed at the wafer level for economic consideration but could be performed at the die level.

Direct wafer bonding can be used if the surface roughness of the two surface to be bonded is less than about 0.5 nm RMS. Plasma activated (or plasma assisted) wafer surfaces to be bonded can be used to improve the direct wafer bonding process. One advantage of plasma activated wafer bonding is that high mechanical strength wafer bonds can be formed at low temperature and that that hydrogen is removed from the wafer surface. The removal of hydrogen in the plasma activated process allows the direct wafer bond a single-crystal SiC wafer surface to a second single-crystal SiC wafer surface without an interface material layer. The direct wafer bond of a SiC surface to a SiC will have high mechanical strength, have high thermal conductivity across the bond interface, and allow high processing temperature such as 1500° C. in some embodiments or 1800° C. in other embodiments. Both hydrophilic and hydrophobic surfaces can be direct wafer bonded; however, hydrophilic has less issues such as hydrogen bubble formation that is common for hydrophobic wafer bonding. The wafer bonding can be performed at room temperature or at elevated temperatures. An anneal in the range of about 400° C. to 1200° C. can increase the wafer bond strength. It can be desirable to have a silicon oxide layer on the surface of the SiC material layers prior to direct wafer bonding. The silicon oxide layer can absorb hydrogen that on the material surfaces and reduce the incidence of hydrogen bubble formation at the wafer bond interface during wafer bonding. In some embodiments, a silicon oxide thickness of more than about 10 nm can be desirable to absorb the hydrogen. In some embodiments, a silicon oxide thickness of more than about 40 nm can be desirable to absorb the hydrogen. Thicker silicon oxide layers can also be used for absorbing the hydrogen and lateral etching for an undercut approach. It is desirable that the silicon oxide be grown by a thermal oxidation process to minimize hydrogen in the silicon oxide layer. It can be desirable to anneal silicon oxide that is grown by Plasma Assisted Chemical Vapor Deposition (PECVD) or Chemical Vapor Deposition (CVD) at temperatures of about 1000° C. to minimize the hydrogen in the silicon oxide layers. An advantage of an LPCVD silicon nitride material layer is that the material will have low hydrogen content. PECVD silicon nitride has a high hydrogen content and it is desirable to anneal to remove the hydrogen prior to direct wafer bonding. It is often desirable to chemical mechanical polish the surface of CVD, PECVD, or LPCVD surface to reduce the surface roughness less than 0.5 nm RMS to facilitate direct wafer bonding. Non-vacuum bonding, moderate vacuum bonding (1×10⁻⁶ torr) or UHV vacuum bonding (about 1×10⁻⁹ torr) bonding can be used. A significant advantage of vacuum bonding is that vacuum boning enables a direct wafer bond of SiC material to SiC material. One advantage of a SiC-to-SiC wafer is that extremely high temperature processes are enabled with a SiC-to-SiC wafer bond. For example, oxidation temperature of 1100° C. or higher, or dopant anneal temperatures of 1500° C. or higher, or dopant anneal temperatures of 1800° C. or higher are enabled by a SiC-to-SiC wafer bond. Silicon oxide interface material(s) permit a maximum process temperature of about 1350° C. to 1450° C. after the direct wafer bond. Silicon nitride interface materials permit a maximum process temperature of about 1500° C. to 1600° C. after the direct wafer bond.

Anodic bonding can include SiC to glass bonding in which glass has ionic conductivity to enable anodic bonding. Examples of glass material with sufficient ionic conductivity include Corning 7740 Pyrex glass and Borofloat glasses. Anodic bonding can be performed on surfaces surface roughness greater than 1 nm RMS. Direct wafer bonding typically requires surface roughness less than about 0.5 nm RMS.

Metal-to-metal bonding can include, but is not limited to, gold-to-gold or copper-to-copper thermal compression bonding. The thermal compression bonding is performed at a temperature of about 300 C. It is preferable that the metal-metal bonding be performed at the wafer level but could be performed at the die level.

A combination of anodic bonding and metal-to-metal bonding in laterally separated regions can be used to enable an electrical connection from the SiC material forming the anchor material structure and electrodes formed on the substrate.

Polymer bonding is low cost but can have increased damping.

Electrostatic Sense Electrode

It is desirable that the parasitic capacitance of the electrostatic sense electrode material structure to the first substrate be minimized to reduce the noise at the input to an amplifier that is connected to the sense electrode material structure. The noise at the input to the amplifier is proportional to the capacitance on the electrostatic sense electrode material structure. Thus, it is desirable that the electrostatic sense electrode material structure capacitance be minimized. The interface material thickness and dielectric constant can be selected to minimize sense electrode capacitance to the first substrate. The interface material may be an insulator or high-resistivity material with a resistivity greater than 1×10⁵ ohm-cm. The interface material may include but not be limited to silicon oxide or silicon nitride. The first substrate is semi-insulating or insulating and thus there will not contribute capacitance to the electrostatic sense electrode.

Capacitance of the Sense Electrode

It is desirable to reduce the capacitance between the electrostatic sense electrode material structure and the first substrate. In some embodiments, the capacitance of the electrostatic sense electrode is reduced by using a semi insulating SiC first substrate. In some embodiments, the semi-insulating SiC can have a resistivity greater than 10⁵ ohm-cm. In some embodiments, the semi-insulating SiC can have a resistivity greater than 10⁷ ohm-cm. In some embodiments, the semi-insulating SiC can have a resistivity greater than 10⁹ ohm-cm. In some embodiments, the semi-insulating SiC can have a resistivity greater than 10¹⁰ ohm-cm. In some embodiments, the semi-insulating SiC can have a resistivity greater than 10¹¹ ohm-cm.

In some embodiments, the capacitance of the sense electrode is reduced by using a glass, ceramic, or quartz substrate. In some embodiments, the semi-insulating SiC can have a resistivity greater than 10⁵ ohm-cm. In some embodiments, the glass, ceramic or quartz substrate can have a resistivity greater than 10⁷ ohm-cm. In some embodiments, the glass, ceramic or quartz substrate can have a resistivity greater than 10⁹ ohm-cm. In some embodiments, the glass, ceramic or quartz substrate can have a resistivity greater than 10¹⁰ ohm-cm. In some embodiments, the glass, ceramic or quartz substrate can have a resistivity greater than 10¹¹ ohm-cm.

Wafer Bonding of a Thin Free-Standing Hexagonal Single-Crystal SiC Material

Thin free-standing hexagonal single-crystal SiC second substrate with a thickness in the range of about 50 microns to about 200 microns can be made by thinning a standard thickness (about 350 microns to about 500 micron) hexagonal single-crystal second substrate

An advantage of wafer bonding the thin free-standing hexagonal single-crystal substrate to form the anchor material structure and the suspended material structure is that 1) there is no need to perform further thinning after wafer bonding and 2) it is not required to use a low total thickness variation (TTV) substrate.

The process steps to fabricate a MEMS device using the Thin Free-Standing Hexagonal Single Crystal SiC material approach after direct wafer bonding is similar to the MEMS device fabrication approach that uses a direct wafer bonding followed by thinning approach.

Optional Interface Material Layer

The optional interface material layer can have the properties of being electrically insulating, low surface roughness suitable for direct wafer bonding, thermally conductive to minimize the temperature gradients in a microelectromechanical device, lateral undercut to facilitate the fabrication of a movable suspended material structure, or electrical conductive such as a metal to-metal bond that enables electrical contact to the anchor material structures. The interface material layer(s) can include, but not be limited to, silicon oxide, silicon nitride, polysilicon, aluminum nitride, dielectric, gold, copper, metal, polymer, or glass-frit, or combinations thereof. The interface material layer can absorb hydrogen that is advantageous for direct wafer bonding. The interface material layer can have a surface roughness of less than about 0.5 nm RMS that is advantageous for direct wafer bonding (fusion wafer bonding). The surface of the interface material layers can be chemical mechanical polished to reduce the surface roughness to less than about 0.5 nm. The interface material layers can optionally be laterally undercut to enable a movable suspended material structure using processes such as HF vapor etching, anhydrous HF vapor etching, and wet chemical dilute HF etching for the case of silicon oxide interface material layer. The interface material layers can optionally be laterally undercut to enable a movable suspended material structure using processes such as xenon difluoride (XeF₂) or wet chemical hydrofluoric nitride chemical etch in the case of polysilicon. The interface material layers can optionally be laterally undercut to enable a movable suspended material structure using a process such as hot phosphoric acid etch in the case of LPCVD silicon nitride.

An optional interface material layer dielectric layer may be deposited on the first surface of the 4H-SiC material layer. The optional dielectric layer may include but not be limited to a polishing material layer, an undercut material layer, and insulating layer, or a high temperature compatible material layer. Examples of optional interface material layers include, but are not limited to, silicon nitride, aluminum nitride, and silicon oxide. The silicon nitride may be deposited for example by Low Stress Low Pressure Chemical Vapor Deposition. The aluminum nitride may be deposited by atomic layer epitaxy, MOCVD, or physical vapor deposition. A CMP polish can be performed on the surface of the polishable material layer to achieve a surface roughness less than about 0.5 nm RMS. The optional polishable material layer may also be a material that can be undercut by etching. For example, silicon nitride can be etched in hot phosphoric and fluorine based plasmas. Aluminum nitride can be etched in basic solutions. Silicon nitride can be etched in hydrofluoric acid and plasma etches. The silicon nitride layer and aluminum nitride material layers are compatible with the highest 4H-SiC epitaxial growth temperatures. The silicon oxide material layers will not be compatible with the highest 4H-SiC epitaxial growth temperatures. The silicon nitride, aluminum nitride and silicon oxide are insulating layers which can be desirable for MEMS, lateral power electronic devices, and microelectronic devices.

Substrate

The substrate may include, but not be limited to, a single-crystal hexagonal SiC substrate, a N-type single-crystal hexagonal SiC substrate, a P-type single-crystal hexagonal SiC substrate, a semi-insulating single-crystal hexagonal SiC substrate, an insulating single-crystal hexagonal SiC substrate, a silicon substrate, a glass substrate, a glass substrate with ionic conductivity appropriate for anodic bonding, a ceramic substrate, a polycrystalline substrate, a hexagonal single crystal SiC substrate having a SiC epitaxial layer having microelectronic circuits formed in the SiC epitaxial layer for control of and processing of data from microelectromechanical systems or silicon substrate having microelectronic circuits for control of and processing of data from microelectromechanical systems. An advantage of a hexagonal SiC substrate with N-type doping is that it is significantly less expensive than a semi-insulating or insulating hexagonal SiC substrate. The substrate may include, but not be limited to, a high temperature compatible substrate, a linear coefficient of thermal expansion matched substrate, high mechanical strength substrate, high thermal conductivity substrate, a matched thermal conductivity substrate, a low total thickness variation (TTV) substrate, a substrate with low total thickness variation (TTV) and also an low thickness uncertainty, a low surface roughness substrate, a semi-insulating substrate, an insulating substrate, an electrically conductive substrate, a substrate with N-type or P-type doping regions in the substrate, a substrate with etched recesses, a substrate with microelectronic devices, a substrates with patterned electrical electrodes on the surface of the substrate, a substrate with patterned electrical electrodes formed in the recesses of the substrate, a low cost substrate, or an optically transparent substrate, and combination therefore. The substrate properties may include, but not be limited to, a single-crystal substrate, a noncrystalline substrate, a semiconductor substrate, a semi-insulating substrate, an insulating substrate, a glass substrate, a ceramic substrate, polycrystalline substrate, or a metal substrate. The substrate may be patterned and etched to form recessed regions in the substrate.

The linear thermal expansion coefficient of the substrate may have a value that is within 10 percent of the thermal expansion coefficient the 3C-Si material layers in some embodiments, within 20 percent of the 4H-SiC material layers in some embodiments, within 50 percent of the 4H-SiC material layers in some embodiments, and within 100 percent of the 4H-SiC material layers in some embodiments.

Silicon carbide 4H-SiC, 6H-SiC, CVD polycrystalline SiC substrate, diamond, and aluminum nitride substrates substrate have the properties that the substrates have high mechanical strength substrate, high thermal conductivity substrate (>300 W/mK), can be a semi-insulating substrate (>1×10⁵ ohm-cm), can be an insulating substrate (vanadium doped SiC 1×10¹⁰ ohm-cm) (AlN >1×10¹⁰ ohm-cm) and an optically transparent substrate to visible, near ultraviolet, near infrared, and infrared wavelengths. Silicon carbide substrates also have the property that the substrate can be electrically conductive substrate. The semi-insulating single-crystal SiC substrate types may include, but not be limited to, vanadium doped semi-insulating single-crystal SiC substrate, high purity physical vapor transport (PVT) grown semi-insulating single-crystal SiC substrates, and High Temperature Chemical Vapor Deposited (HTCVD) high purity semi-insulating SiC substrates.

Another aspect of this invention is that the hexagonal single-crystal SiC material that is used to form the suspended material structure can be bonded on a substrate with approximately matched linear coefficient of thermal expansion. An advantage of having a substrate with a linear coefficient of expansion that about matches the linear thermal expansion coefficient of the hexagonal single-crystal SiC material layer is that the matched thermal coefficient of expansion facilitates the wafer bonding of the two material layers. Material layers with different thermal expansion coefficient can debond, crack and have significant wafer bow during from higher temperature processes such as annealing to increase the bond strength or growth of a thermal oxide layer. The 4H-SiC, 6H-SiC and CVD polycrystalline substrate approximately matched the linear thermal coefficient of expansion of the hexagonal signal crystal SiC layer use to form the suspended material structure. Thus, very thick 4H-SiC material layers can be bonded without extensive substrate or wafer bow. For example, the 4H-SiC material layer may be about 40 microns thick in some embodiments, about 100 microns thick in some embodiments, about 200 microns thick in some embodiments, or about 500 microns thick in some embodiments.

Suspended Microelectromechanical Materials Structures

A MEMS device may be configured as a resonator that is used in timing devices. The resonator may have a variety of physical shapes, e.g., beams and plates. The MEMS device may have a portion suspended from the substrate (e.g., a suspended mass, body, or resonator) attached to the substrate by an anchor. The suspended material structure may be a feature such as, but not limited to, a beam, a plate, a cantilever arm, or a tuning fork. In a specific embodiment, a MEMS device includes a resonating feature (e.g., suspended mass) flanked by one or more drive electrodes and one or more sense electrodes.

In some embodiments, the movable suspended material structure(s) comprises hexagonal single-crystal SiC material layer on a silicon oxide layer on a substrate that is laterally undercut to form a movable suspended material structure beam. In some embodiments, the movable suspended material structure(s) comprises hexagonal single-crystal SiC material layer on a substrate with etched recess region to aid in enabling movable suspended material structures. The substrate may have patterned electrical electrodes within the etched recesses.

A recess region can be formed in the in the substrate on the substrate first surface prior to the wafer bonding on the 4H-SiC material layer. The recess region can enable movable hexagonal single-crystal material structures that are formed by plasma etching of trenches vertically entirely through hexagonal single-crystal SiC material layer. An etch protect material layer may be formed within the recess region. A patterned electrical electrode may be formed in the recess region and optionally on the upper first surface of the substrate.

Thinning of Hexagonal Single-Crystal SiC Material Layer

After wafer bonding of the hexagonal single-crystal material layer (optional with an interface material layer) to the substrate (with optional interface material layer), the hexagonal single crystal SiC material that is used to form the suspended material structure can be thinned to a selected thickness a combination of grinding, CMP polishing, and/or RIE etching. The selected thickness of the hexagonal single-crystal material used to form the suspended material structure can be for example 1 micron thick, 2 micron thick, 4 micron thick, 10 micron thick, 20 micron thick, 40 micron thick, 100 micron thick, 200 um thick, or 500 micron thick. One approach to reduce the residual stress and subsurface damage at the first surface of the suspended material structure of the thinning operation is to use a stress release chemical mechanical polish (CMP) and/or a plasma etch process. The thinning approach can include a combination of grinding, polishing, and chemical mechanical polishing. The chemical polishing procedure is important to reduce the stress and subsurface damage at the grinding and polish surface of single-crystal SiC second substrate.

Deep Trench SiC Etching

In some MEMS devices, the actuation or sensing can be by electrostatic coupling. The electrostatic coupling between the suspended material structure and the anchor material structure is dependent on the width of the trench etched region and the sidewall angle of the trench region. The sidewall angle of the deep trench can be in the range of about 3 degrees to 15 degrees off of the vertical axis. The aspect ratio of the deep trench can be in the range of greater than 5 to 1 to greater than 100 to 1. The width of the trench can be as small as about 0.5 microns or as large as about 5 to 8 microns. The width of the deep trench can be about 1 micron for a suspended material structure than is less than about 10 microns thick. The width of the deep trench can be about 2 micron for a suspended material structure that is less than about 20 microns thick. The width of the deep trench can be about 3 microns for a suspended material structure than is less than about 40 microns thick. The width of the deep trench can be about 4 micron for a suspended material structure than is less than about 60 microns thick. The deep trench etch entirely through the thickness of the N-type hexagonal single-crystal layer can be performed by ICP-RIE SiC etching using gases such SF6 plus argon, oxygen, or other gases to form movable suspended material structures above the recesses.

Electrostatic coupling to a 4H-SiC beam typically requires that the beam have an electrical conductivity and thus it is typically preferred that the 4H-SiC material be doped N-type with a doping concentration in the range of 5×10¹⁸ cm⁻³ to 1×10¹⁹ cm⁻³. Commercial 4H-SiC SiC substrates can be N-type. 4H-SiC epitaxial layers can be grown to be N-type to selected doping in the range of 1×10¹⁴ cm⁻³ to about 1×10²⁰ cm⁻³.

A hexagonal single-crystal SiC suspended material structure and anchor material structure can have a first surface (top surface) that is a carbon face and a second surface (bottom surface) that is silicon face. A hexagonal single-crystal SiC suspended material structure and anchor material structure can have a first surface (top surface) that is a silicon face and a second surface (bottom surface) that is carbon face.

Example Device Embodiment 2

In another embodiment, this invention provides one or more than one suspended material structure(s) that comprise hexagonal single-crystal SiC material having a first surface and a second surface with each suspended material structure attached (fixed) to one or more than one anchor material structures that are bonded to a first substrate with no interface material layer, one optional interface material layer or more than one optional interface material layers at the interface between the hexagonal single-crystal SiC material layer and the first substrate. The anchor material structure comprise hexagonal single-crystal hexagonal SiC material. The anchor material structure and the suspended material structure may be formed from a single-crystal hexagonal SiC material and the anchor material structure is bonded (attached) to the first substrate and the suspended material structure is not attached to the first substrate. The substrate may be a singlecrystal SiC substrate.

The first substrate may have an etched recess region on the substrate first surface to facilitate the formation of the movable suspended material structures. The substrate may have patterned electrical electrodes on the substrate first surface, within recesses etched into the first substrate, and within recesses etched into the substrate and on the substrate first surface. The electrical electrode contact can be formed on the second surface (bottom side) of the hexagonal single-crystal material structure anchor material structure.

FIG. 9 shows a hexagonal single-crystal SiC on optional interface material layer(s) on a hexagonal single-crystal first substrate with trenches etched through the hexagonal single-crystal SiC suspended material structure and an RIE etch stop protect layer and electrical electrode that makes electrical contact to the anchor material region. The structure comprises an electrical conductive bond contact (optionally metal to metal bond) 900, an anchor material structure region 902, trench etched regions 904, movable suspended hexagonal single-crystal SiC material structures 906 (beams, membranes, cantilevers, or bridges) with one or more than one attachments to anchor structure material for MEMS applications, an optional doped region in SiC to reduce ohmic contact resistance 908, an electrical electrode contact 909, an electrical conductive bond contact (optionally metal to metal bond contact) 910, an electrical electrode 912, a hexagonal single-crystal SiC substrate (optionally semi-insulating) 914, an electrical electrode 916, an ME etch protect layer (optionally electrical electrode) 918, and recess regions 920.

FIG. 10 shows hexagonal single-crystal SiC anodically bonded to a glass substrate and simultaneously metal-to-metal bond in a laterally separated region with an ME etch stop protect layer and electrical electrode that makes electrical contact to the anchor material region. The structure comprises an electrical conductive bond contact (optionally metal to metal bond) 1000, an anchor material structure region 1002, trench etched regions 1004, movable suspended hexagonal single-crystal SiC material structures 1006 (beams, membranes, cantilevers, or bridges) with one or more than one attachments to anchor structure material for MEMS applications, an optional doped region in SiC to reduce ohmic contact resistance 1008, an electrical electrode contact to SiC 1009, an anodic bond interface 1010, a metal to metal bond 1012, semi-insulating or insulating hexagonal SiC substrate or glass substrate with ionic conduction for anodic bonding such as Pyrex 7740 or borofloat 1014, an electrical electrode 1016, an ME etch protect layer (optionally electrical electrode) 1018, and recess regions 1020.

FIG. 11 shows a hexagonal single-crystal SiC with anchor material regions electrically attached to a silicon substrate or a SiC substrate with epitaxial layer having microelectronic devices such as MOSFET for the control of and processing data from a MEMS. The structure comprises an electrical conductive bond contact (optionally metal to metal bond) 1100, an anchor material structure region 1102, trench etched regions 1104, movable suspended hexagonal single-crystal SiC material structures 1106 (beams, membranes, cantilevers, or bridges) with one or more than one attachments to anchor structure material for MEMS applications, an optional doped region in SiC to reduce ohmic contact resistance 1108, an electrical electrode contact to SiC 1110, an electrical conductive bond contact (optionally metal to metal bond contact) 1112, an electrical electrode 1114, a hexagonal single-crystal SiC substrate (optionally semi-insulating) 1116, an electrical electrode 1118, an SiC epitaxial layer on SiC substrate or silicon substrate 1120, microelectronic circuitry for control of and processing data from a MEMS structure 1122, and an RIE etch protect layer (optionally electrical electrode) 1124.

FIG. 12 shows a hexagonal single-crystal SiC on optional interface material layer(s) on a hexagonal single-crystal substrate with trenches etched in hexagonal single-crystal SiC suspended material structure with the use of electrically conductive doped polycrystalline silicon surface to facilitate anodic bonding to a glass. The structure comprises an anodic bond interface 1200, an anchor material structure region 1202, trench etched regions 1204, movable suspended hexagonal single-crystal SiC material structures 1206 (beams, membranes, cantilevers, or bridges) with one or more than one attachments to anchor structure material for MEMS applications, an electrically conductive doped polysilicon 1212, an anodic bond interface 1213, An electrically conductive contact of metal to electrically conductive doped polysilicon 1214, a glass substrate with ionic conduction for anodic bonding such as Pyrex 7740 or borofloat 1216, an electrical electrode and optional RIE etch protect 1218, and recess regions 1220.

Example Method 1: Metal Electrode Contact to the First Surface of the Anchor Material Structure (FIG. 13)

-   -   1. 6H-SiC or 4H-SiC semi-insulating single-crystal first         substrate.     -   2. Thin and polish the 6H-SiC or 4H-SiC semi-insulating         single-crystal first substrate to a low total thickness         variation (TTV) and to a selected thickness.     -   3. Photolithography step 1: Photodefine region for etching         alignment marks in the semi insulating single-crystal first         substrate     -   4. RIE etch alignment marks about 0.1-0.3 microns deep into the         hexagonal semi-insulating single-crystal SiC first substrate and         strip etch-mask     -   5. Photolithography step 2: Photodefine region for etching a         recess in the first surface of the semi-insulating         single-crystal first substrate.     -   6. RIE etch a recess about three microns deep into the first         surface of the hexagonal semi insulating single-crystal first         substrate and strip etch-mask.     -   7. Optionally-grow about 40 nm thermal oxide interface material         layer on first surface and recess surface of the semi-insulating         single-crystal first substrate.     -   8. Optionally grow about 40 nm thick thermal oxide on N-type         6H-SiC or N-type 4H-SiC single-crystal second substrate.     -   9. Photolithography step 3: Photodefine RIE etch protect         material layer. The RIE etch protect layer is a material layer         that has a slow etch rate in the SiC RIE etch gases. The RIE         etch protect layer may include but not be limited to nickel         metal layer, aluminum metal layer, indium tin oxide material         layer, and an aluminum nitride material layer. The RIE etch         protect layer can be an electrical electrode.     -   10. Optionally deposit polysilicon with thickness greater than         the recess depth and polish flat with low surface roughness less         than 0.5 nm rms.     -   11. Direct wafer bond the first surface of the hexagonal         semi-insulating single-crystal SiC surface to the N-type doped         hexagonal single-crystal material. The surface of the optional         silicon oxide interface material layers may be activated prior         to wafer bonding by plasma activation and/or chemical         activation. The direct wafer bonding process may be a non-vacuum         direct wafer bond process, a vacuum direct wafer bonding         process, or a UHV vacuum direct wafer bonding process.     -   12. Anneal at 400° C. to 1100° C. to increase the bond strength         of the direct wafer bonded region.     -   13. Thin the N-type doped hexagonal single-crystal material to 2         to 200 micron final thickness and perform a CMP polish for         stress reduction and removal of subsurface damage.     -   14. Photolithography step 4: Photodefine region for etching         top-side alignment marks in the N type doped hexagonal         single-crystal material.     -   15. RIE etch alignment marks about 0.1-0.3 microns deep into the         N-type doped hexagonal single-crystal material and strip         etch-mask.     -   16. Optional Photolithography step to define region for an         N-type dopant (for example nitrogen ion) ion implantation into a         patterned region of the N-type doped hexagonal single-crystal         material.     -   17. Optional anneal at about 1500° C. or about 1600° C. to         activate the N-type nitrogen ion implantation dopant.     -   18. Photolithography step 5: Photodefine a metal layer that         makes ohmic contact to N-type hexagonal single-crystal SiC first         surface. A thin titanium layer (about 10 nm) and a nickel layer         about 100 nm thick can be used to make an ohmic contact to the         first surface of the N type hexagonal single-crystal SiC         material layer after heat-treatment.     -   19. Photolithography step 6: Photodefine a gold layer 300 nm or         thicker that can facilitate the wire bonding to the metal on the         first surface of the N-type hexagonal single-crystal SiC         material layer.     -   20. Photolithography step 7: Photodefine a protect layer         material layer that protects the metal for the ohmic contact to         the first surface of the N-type hexagonal single-crystal SiC         material layer. The protect layer material may be gold or         another material resistant to the chemicals used in subsequent         steps.     -   21. Photolithography step 8: Photodefine a material layer that         performs as a RIE etch definition layer for the SiC trench etch         on the first surface of the N-type hexagonal single-crystal SiC.         The RIE etch definition masking layer that defines where SiC         will be etched can be a nickel layer, an aluminum layer, an         aluminum nitride layer, or an indium thin oxide layer, or         combinations thereof. The nickel layer can be formed by         electroplating nickel inside of a photodefined resist mode or         deposition of nickel and a resist or dielectric masking layer         followed by a subtractive etch using ion beam milling or plasma         etching. Nickel can also be etched by chemical etching. The         aluminum layer can be subtractive etched by RIE plasma etch.     -   22. Perform the ICP-RIE SiC trench etch entirely through the         thickness of the N-type hexagonal single-crystal layer using         gases such SF6 plus argon, oxygen, or other gases to form         movable suspended material structures above the recesses.     -   23. Remove the nickel masking layer and then perform critical         point drying to prevent striction.     -   24. Shadow mask deposit gold wire-bond pads for contact to         recess metal.     -   25. Separate, die-bond, and wire-bond to MEMS die.

Example Method 2: Use of Free-Standing Thin Hexagonal Single-Crystal SiC Substrate for Anchor Material Structure and Suspended Material Structure (Metal Electrode Contact to the First Surface of the Anchor Material Structure) (FIG. 14)

-   -   1. 6H-SiC or 4H-SiC semi-insulating single-crystal first         substrate.     -   2. Thin and polish the 6H-SiC or 4H 8iC semi-insulating         single-crystal first substrate to a low total thickness         variation (TTV) and to a selected thickness.     -   3. Photolithography step 1: Photodefine region for etching         alignment marks in the semi insulating single-crystal first         substrate.     -   4. RIE etch alignment marks about 0.1-0.3 microns deep into the         hexagonal semi-insulating single-crystal SiC first substrate and         strip etch-mask.     -   5. Photolithography step 2: Photodefine region for etching a         recess in the first surface of the semi-insulating         single-crystal first substrate.     -   6. RIE etch a recess about three microns deep into the first         surface of the hexagonal semi insulating single-crystal first         substrate and strip etch-mask.     -   7. Optionally-grow about 40 nm thermal oxide interface material         layer on first surface and recess surface of the semi-insulating         single-crystal first substrate.     -   8. Optionally grow about 40 nm thick thermal oxide on N-type         6H-SiC or N-type 4H-SiC single-crystal second substrate.     -   9. Photolithography step 3: Photodefine RIE etch protect         material layer. The RIE etch protect layer is a material layer         that has a slow etch rate in the SiC RIE etch gases. The RIE         etch protect layer may include but not be limited to nickel         metal layer, aluminum metal layer, indium tin oxide material         layer, and an aluminum nitride material layer. The RIE etch         protect layer can be an electrical electrode.     -   10. Optionally deposit polysilicon with thickness greater than         the recess depth and polish flat with low surface roughness less         than 0.5 nm rms.     -   11. Direct wafer bond the first surface of the hexagonal         semi-insulating single-crystal SiC surface to the thin         free-standing N-type doped hexagonal single-crystal material.         The surface of the optional silicon oxide interface material         layers may be activated prior to wafer bonding by plasma         activation and/or chemical activation. The direct wafer bonding         process may be a non-vacuum direct wafer bond process, vacuum         direct wafer bonding process, or a UHV vacuum direct wafer         bonding process.     -   12. Anneal at 100° C. to 1100° C. to increase the bond strength         of the direct wafer bonded region.     -   13. Photolithography step 4: Photodefine region for etching         top-side alignment marks in the N type doped hexagonal         single-crystal material.     -   14. RIE etch alignment marks about 0.1-0.3 microns deep into the         N-type doped hexagonal single-crystal material and strip         etch-mask.     -   15. Optional Photolithography step to define region for an         N-type dopant (for example nitrogen ion) ion implantation into a         patterned region of the N-type doped hexagonal single-crystal         material.     -   16. Optional anneal at about 1500° C. or about 1600° C. to         active the N-type nitrogen ion implantation dopant.     -   17. Photolithography step 5: Photodefine a metal layer that         makes ohmic contact to N-type hexagonal single-crystal SiC first         surface. A thin titanium layer (about 10 nm) and a nickel layer         about 100 nm thick can be used to make an ohmic contact to the         first surface of the N type hexagonal single-crystal SiC         material layer after heat-treatment.     -   18. Photolithography step 6: Photodefine a gold layer 300 nm or         thicker that can facilitate the wire bonding to the metal on the         first surface of the N-type hexagonal single-crystal SiC         material layer.     -   19. Photolithography step 7: Photodefine a protect layer         material layer that protects the metal for the ohmic contact to         the first surface of the N-type hexagonal single-crystal SiC         material layer. The protect layer material may be gold or         another material resistant to the chemicals used in subsequent         steps.     -   20. Photolithography step 8: Photodefine a material layer that         performs as a RIE etch definition layer for the SiC trench etch         on the first surface of the N-type hexagonal single-crystal SiC.         The RIE etch definition layer that defines where SiC will be         etched can be a nickel layer, an aluminum nitride layer, or an         indium thin oxide layer or combinations thereof     -   21. Perform the ICP-RIE SiC trench etch entirely through the         thickness of the N-type hexagonal single-crystal layer using         gases such SF6 plus argon, oxygen, or other gases to form         movable suspended material structures above the recesses.     -   22. Remove the nickel masking layer and then perform critical         point drying to prevent striction.     -   23. Shadow mask deposit gold wire-bond pads for contact to         recess metal.     -   24. Separate, die-bond, and wire-bond to MEMS die.

Example Method 3: Use of Epitaxial Hexagonal Single-Crystal SiC Material for Anchor Material Structure and Suspended Material Structure (Metal Electrode Contact to the First Surface of the Anchor Material Structure)

-   -   1. 6H-SiC or 4H-SiC semi-insulating single-crystal first         substrate.     -   2. Thin and polish the 6H-SiC or 4H 8iC semi-insulating         single-crystal first substrate to a low total thickness         variation (TTV) and to a selected thickness.     -   3. Photolithography step 1: Photodefine region for etching         alignment marks in the semi insulating single-crystal first         substrate.     -   4. RIE etch alignment marks about 0.1-0.3 microns deep into the         hexagonal semi-insulating single-crystal SiC first substrate and         strip etch-mask.     -   5. Photolithography step 2: Photodefine region for etching a         recess in the first surface of the semi-insulating         single-crystal first substrate.     -   6. RIE etch a recess about three microns deep into the first         surface of the hexagonal semi insulating single-crystal first         substrate and strip etch-mask.     -   7. Optionally-grow about 40 nm thermal oxide interface material         layer on first surface and recess surface of the semi-insulating         single-crystal first substrate.     -   8. Grow an N-type SiC epitaxial layer on the surface of the         N-type 6H-SiC or N-type 4H SiC single-crystal second substrate.         The N-type SiC epitaxial layer can have a thickness of about 4         microns to about 200 microns.     -   9. Perform a CMP polish of the surface of the epitaxial layer to         achieve a surface roughness less than 0.5 nm RMS.     -   10. Optionally grow about 40 nm thick thermal oxide on N-type         6H-SiC or N-type 4H-SiC single-crystal second substrate.     -   11. Photolithography step 3: Photodefine RIE etch protect         material layer. The RIE etch protect layer is a material layer         that has a slow etch rate in the SiC RIE etch gases. The RIE         etch protect layer may include but not be limited to nickel         metal layer, aluminum metal layer, indium tin oxide material         layer, and an aluminum nitride material layer. The RIE etch         protect layer can be an electrical electrode.     -   12. Optionally deposit polysilicon with thickness greater than         the recess depth and polish flat with low surface roughness less         than 0.5 nm rms     -   13. Direct wafer bond the first surface of the hexagonal         semi-insulating single-crystal SiC surface to the N-type doped         hexagonal single-crystal material. The surface of the optional         silicon oxide interface material layers may be activated prior         to wafer bonding by plasma activation and/or chemical         activation. The direct wafer bonding process may be a non-vacuum         direct wafer bond process, a vacuum direct wafer bonding         process, or a UHV vacuum direct wafer bonding process.     -   14. Anneal at 400° C. to 1100° C. to increase the bond strength         of the direct wafer bonded region.     -   15. Thin the N-type doped bulk hexagonal single-crystal material         with the N-type epitaxial layer to within about 5 μm from the         interface of the N-type doped hexagonal single crystal material         and the semi-insulating SiC substrate leaving about 5 μm of         N-type doped bulk hexagonal single-crystal SiC on the exposed         surface to facilitate making ohmic contact to the N-type         material. Perform a CMP polish for stress reduction and removal         of subsurface damage.     -   16. Optional Photolithography step to define region for an         N-type dopant (for example nitrogen ion) ion implantation into a         patterned region of the N-type doped hexagonal single-crystal         material.     -   17. Optional anneal at about 1500° C. or about 1600° C. to         active the N-type nitrogen ion implantation dopant.     -   18. Photolithography step 4: Photodefine region for etching         top-side alignment marks in the N type doped hexagonal         single-crystal material.     -   19. RIE etch alignment marks about 0.1-0.3 microns deep into the         N-type doped hexagonal single-crystal material and strip         etch-mask.     -   20. Photolithography step 5: Photodefine a metal layer that         makes ohmic contact to N-type hexagonal single-crystal SiC first         surface. A thin titanium layer (about 10 nm) and a nickel layer         about 100 nm thick can be used to make an ohmic contact to the         first surface of the N type hexagonal single-crystal SiC         material layer after heat-treatment.     -   21. Photolithography step 6: Photodefine a gold layer 300 nm or         thicker that can facilitate the wire bonding to the metal on the         first surface of the N-type hexagonal single-crystal SiC         material layer.     -   22. Photolithography step 7: Photodefine a protect layer         material layer that protects the metal for the ohmic contact to         the first surface of the N-type hexagonal single-crystal SiC         material layer. The protect layer material may be gold or         another material resistant to the chemicals used in subsequent         steps.     -   23. Photolithography step 8: Photodefine a material layer that         performs as a RIE etch definition layer for the SiC trench etch         on the first surface of the N-type hexagonal single-crystal SiC.         The RIE etch definition layer that defines where SiC will be         etched can be a nickel layer, an aluminum nitride layer, or an         indium thin oxide layer or combinations thereof     -   24. Perform the ICP-RIE SiC trench etch entirely through the         thickness of the N-type hexagonal single-crystal layer using         gases such SF6 plus argon, oxygen, or other gases to form         movable suspended material structures above the recesses.     -   25. Remove the nickel masking layer and then perform critical         point drying to prevent striction.     -   26. Shadow mask deposit gold wire-bond pads for contact to         recess metal.     -   27. Separate, die-bond, and wire-bond to MEMS die.

Example Method 4: Metal Electrode Contact to the Second Surface of the Anchor Material Structure with Metal-to-Metal Bond

-   -   1. 6H-SiC or 4H-SiC semi-insulating single-crystal first         substrate.     -   2. Thin and polish the 6H-SiC or 4H-SiC semi-insulating         single-crystal first substrate to a low total thickness         variation (TTV) and to a selected thickness.     -   3. Photolithography step 1: Photodefine region for etching         alignment marks in the semi insulating single-crystal first         substrate.     -   4. RIE etch alignment marks about 0.1-0.3 microns deep into the         hexagonal semi-insulating single-crystal SiC first substrate and         strip etch-mask.     -   5. Photolithography step 2: Photodefine region for etching a         recess in the first surface of the semi-insulating         single-crystal first substrate.     -   6. RIE etch a recess about three microns deep into the first         surface of the hexagonal semi insulating single-crystal first         substrate and strip etch-mask.     -   7. Photolithography step 3: Photodefine RIE etch protect         material layer. The RIE etch protect layer is a material layer         that has a slow etch rate in the SiC RIE etch gases. The ME etch         protect layer may include but not be limited to nickel metal         layer, aluminum metal layer, indium tin oxide material layer,         and an aluminum nitride material layer. The ME etch protect         layer can be an electrical electrode. Alternately, the ME etch         protect material layer can protect a gold or copper electrical         electrode that are appropriate for metal-to-metal thermal         compression bonding as shown in FIG. 9. Photodefine gold or         copper metal electrode so that the metal electrode extends from         the bottom of the recess region over the side of the recess         region to the upper first surface of the substrate.     -   8. Photolithography step 4: Photodefine a metal layer that makes         ohmic contact to the second surface of the N-type hexagonal         single-crystal SiC. A thin titanium layer (about 10 nm) and a         nickel layer about 100 nm thick can be used to make an ohmic         contact to the first surface of the N-type hexagonal         single-crystal SiC material layer after heat-treatment.     -   9. Photolithography step 5. Photodefine a gold or copper layer         on the surface of the ohmic contact metal.     -   10. Perform a gold-to-gold or copper-to-copper thermal         compression metal-to-metal bond at approximately 300° C.     -   11. Thin the N-type doped hexagonal single-crystal material to 2         to 200 micron final thickness using a combination of grinding,         polishing and/or CMP polishing. Perform a CMP polish for stress         reduction and removal of subsurface damage.     -   12. Photolithography step 4: Photodefine region for etching         top-side alignment marks in the N type doped hexagonal         single-crystal material.     -   13. ME etch alignment marks about 0.1-0.3 microns deep into the         N-type doped hexagonal single-crystal material and strip         etch-mask.     -   14. Optional Photolithography step to define region for an         N-type dopant (for example nitrogen ion) ion implantation into a         patterned region of the N-type doped hexagonal single-crystal         material.     -   15. Optional anneal at about 1500° C. or about 1600° C. to         active the N-type nitrogen ion implantation dopant.     -   16. Photolithography step 5: Photodefine a metal layer that         makes ohmic contact to N-type hexagonal single-crystal SiC first         surface. A thin titanium layer (about 10 nm) and a nickel layer         about 100 nm thick can be used to make an ohmic contact to the         first surface of the N type hexagonal single-crystal SiC         material layer after heat-treatment.     -   17. Photolithography step 6: Photodefine a gold layer 300 nm or         thicker that can facilitate the wire bonding to the metal on the         first surface of the N-type hexagonal single-crystal SiC         material layer.     -   18. Photolithography step 7: Photodefine a protect layer         material layer that protects the metal for the ohmic contact to         the first surface of the N-type hexagonal single-crystal SiC         material layer. The protect layer material may be gold or         another material resistant to the chemicals used in subsequent         steps.     -   19. Photolithography step 8: Photodefine a material layer that         performs as a RIE etch definition layer for the SiC trench etch         on the first surface of the N-type hexagonal single-crystal SiC.         The RIE etch definition layer that defines where SiC will be         etched can be a nickel layer, an aluminum nitride layer, or an         indium thin oxide layer or combinations thereof     -   20. Perform the ICP-RIE SiC trench etch entirely through the         thickness of the N-type hexagonal single-crystal layer using         gases such SF6 plus argon, oxygen, or other gases to form         movable suspended material structures above the recesses.     -   21. Remove the nickel masking layer and then perform critical         point drying to prevent striction.     -   22. Shadow mask deposit gold wire-bond pads for contact to         recess metal.     -   23. Separate, die-bond, and wire-bond to MEMS die.

Example Method 5

Metal electrode contact to the second surface of the anchor material structure with simultaneous metal-to-metal bonding and SiC to substrate bonding. Select the depth of the RIE etch recess, the thickness of the electrode metal in the recess, and the thickness of the metal that contacts the second surface of the N-type hexagonal single-crystal SiC material layer to allow simultaneous metal-to-metal bond and direct wafer bond of SiC surface to SiC surface. Alternately, select the depth of the RIE etch recess in glass, the thickness of the electrode metal in the recess, and the thickness of the metal that contacts the second surface of the N-type hexagonal single-crystal SiC material layer to allow simultaneous metal-to-metal bond and direct wafer bond of SiC surface to glass anodic bonding. A stepped region in the RIE etched recess in the SiC substrate or the glass substrate as shown in FIG. 10 can be used to allow simultaneous metal-to-metal bond and anodic bond of the SiC surface to glass substrate (suitable for anodic bonding).

The above descriptions are those of the preferred embodiments of the invention. Various modifications and variations are possible in light of the above teachings without departing from the spirit and broader aspects of the invention. It is therefore to be understood that the claimed invention may be practiced otherwise than as specifically described. Any references to claim elements in the singular, for example, using the articles “a,” “an,” “the,” or “said,” is not to be construed as limiting the element to the singular. 

What is claimed as new and desired to be protected by Letters Patent of the United States is:
 1. A silicon carbide MEMS structure, comprising: one or more suspended material structures comprising hexagonal single-crystal SiC material, wherein the thickness of the one or more suspended material structures is greater than 1 micron and up to 500 microns; one or more anchor material structures comprising hexagonal single-crystal SiC material; and a substrate; wherein the one or more suspended material structures are attached to the one or more anchor material structures; and wherein the one or more anchor material structures are bonded to the substrate.
 2. The silicon carbide MEMS structure of claim 1, wherein the substrate is semi-insulating.
 3. The silicon carbide MEMS structure of claim 1, wherein the hexagonal single-crystal SiC material is a 4H or 6H SiC material.
 4. The silicon carbide MEMS structure of claim 1, wherein the substrate has an etched recess region.
 5. The silicon carbide MEMS structure of claim 1, wherein the substrate has patterned electrical electrodes.
 6. The silicon carbide MEMS structure of claim 1, wherein the one or more anchor material structures are bonded to the substrate by direct wafer bonding.
 7. The silicon carbide MEMS structure of claim 1, wherein the aggregate linear thermal expansion coefficient of the substrate has a value that is within about 10 percent of the thermal expansion coefficient on the SiC material used for the suspended material structure.
 8. The silicon carbide MEMS structure of claim 1, wherein the SiC used for the suspended material structure has a residual stress less than about 100 MPa.
 9. The silicon carbide MEMS structure of claim 1, wherein the substrate is a glass substrate.
 10. The silicon carbide MEMS structure of claim 1, wherein the one or more anchor material structures are bonded to the substrate by anodic bonding.
 11. A method of making a silicon carbide MEMS structure, comprising: bonding a hexagonal single-crystal SiC material to a substrate, wherein the thickness of the hexagonal single-crystal SiC material is greater than 1 micron and up to 500 microns; and etching trenches entirely through the hexagonal single-crystal SiC material to form suspended material structures.
 12. The method of claim 11, further comprising etching a recess into a first surface of the substrate before bonding the hexagonal single-crystal SiC material.
 13. The method of claim 11, wherein the substrate is semi-insulating.
 14. The method of claim 11, wherein the substrate is a 4H or 6H SiC substrate.
 15. The method of claim 11, wherein the substrate has patterned electrical electrodes.
 16. The method of claim 11, wherein the one or more anchor material structures are bonded to the substrate by direct wafer bonding.
 17. The method of claim 11, wherein the substrate is a glass substrate.
 18. The method of claim 11, wherein the one or more anchor material structures are bonded to the substrate by anodic bonding. 